Shenzen PCB


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Items Technical datasremarkslayers1-12 layers  Base materialsCEM-3,FR-4,aluminium,CEM-1,22F,FR-1 Board Thickness0.35mm-3.20mm (14mil-126mil)  Minimum core board thickness0.1mm(4mil) Copper thickness1/2 oz min;3 oz max.  Minimum Line Width/spacing0.1mm(4mil) Minimum Hole Diameter0.25mm(10mil) PTH Hole Tolerance0.9mm(35mil) ToleranceHole site±0.075mm(3mil) Line width±0.1mm(4mil)or line width ±20% Hole sizePTH±0.1mm(4mil) NPTH±0.075mm(3mil)  Exterior tolerance milling machine±0.15MM(6mil)punch machine ±0.10mm(4mil) Twist and Warp0.70%-1% Surface finishes Nickel/Gold Plating/Entek/HASL/EING/Lead-free HASL insulating resistance10KΩ-20MΩ conduction resistance< 50Ω Testing Voltage300V V-cutPanel size110×100mm(min.) 660×600mm(max.)  Board thickness0.6mm(24mil)min. Remaining thickness0.3mm(12mil)min. Tolerance±0.1mm(4mil) slot width0.50mm(20mil)max. Slot to slot width10mm min.  Slot to line0.50mm(20mil)min. Slot Slot size tol.>=2W tolerancePTH L:±0.15mm(6mil) W:±0.1mm(4mil) Where:L=Slot length W=Slot width Min.drill bit size for multi-drill is 0.7mm NPTH L:±0.125mm(5mil)W:±0.1mm(4mil) Minimum Hole registration tolerancePTH Hole:0.13mm(5mil)  NPTH Hole:0.18(7mil)  Registration Tolerance of Front/Back image Minimum Pattern registration tolerance0.075mm(3mil) multilayerInterlayer tolerance4 layers:0.15mm(6mil)max. 6 layers:0.25mm(10mil)max. Minimum distance between hole and inner roundness0.25mm(10mil) Minimum distance board edge and inner roundness 0.25mm(10mil) Board thickness tolerance4 layers:±0.13mm(5mil)  6 layers:±0.15mm(6mil) natural impedance60 ohm±10%